Siemens EDA is a global technology leader in Electronic Design Automation (EDA) software.

Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively.

Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design.

Application and Product Engineer, Semiconductor Process and Device Simulations

Join the Calibre R&D Team at Siemens EDA

We are seeking a highly motivated researcher and application engineer, preferably with expertise in semiconductor fabrication process (integration flow and key modules as sputter etch, chemical etch, CMP, deposition, Epitaxy, ion implantation, annealing, etc.), semiconductor metrology (optical or eBeam based), semiconductor devices physics, Design-Technology Co-optimization (DTCO).

About Us

The Calibre family of tools is the industry leader in EDA/CAD solutions for semiconductor manufacturing, enabling simulations and diagnostics from the transistor to the package level. As the semiconductor industry continues its rapid growth, there is a critical demand for high-fidelity modeling and high-throughput numerical simulations to support the production of stable, high-volume chips at advanced technology nodes.

In this pivotal role, you will collaborate with industry leaders to develop groundbreaking tools that accelerate semiconductor manufacturing and device performance study at the most advanced nodes (logic 2/1.4/1.0/0.7nm and beyond, 3D NAND, 6/4F2 DRAM, and 3DIC packaging). Our solutions will deliver significant performance gains over conventional approaches, essential for supporting high-volume manufacturing and the agile turnaround times our customers demand.

Qualifications

The ideal candidate should possess the following education and experience:

Education & Background

• PhD (or MS + 5+ years of research/industry experience) in Electrical Engineering, Applied Physics, or Other Engineering (Material Science, Mechanical, etc.), with expertise in:

o Semiconductor Fabrication Process: unit process modules such as plasma-based dry etch, wet etch/cleaning, CVD, PVD, ALD, CMP, Epitaxy, Ion Implantation, Annealing, etc. Integration flow for advanced logic transistors (FinFET, NSFET, CFET), DRAM (COB, vertical PassGates, 3D), 3D NAND and 3DIC (TSV, RDL), CIS, LED, etc.

o Semiconductor Device Physics: semiconductor band-structure and carrier transport, reliability issues, etc.

o Semiconductor Metrology: Optical (scatterometry, ellipsometry), eBeam (SEM) based.

Key Skills & Attributes

• Strong problem-solving skills with a passion for tackling complex application challenges.
• Ability to estimate application task complexity, timeline and deliver on schedule.
• Open and collaborative team mindset. Good communication skills.

Locations

Preferred at (TW) Hsinchu Area, (JP) Hokkaido or Tokyo Area, (KR) Seoul Area and Hybrid-mode

Working at Siemens Software Why us?

Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software. We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.