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SOFTWARE ENGINEER(SEMICONDUCTOR DIGITAL TWIN) - 519814
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INFRASTRUCTURE ENGINEER - ADVANCED - 525757
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SENIOR DIRECTOR, TECHNICAL BUSINESS DEVELOPMENT - 3DIC & ADVANCED PACKAGING - 517960
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Seoul, South Korea
SOFTWARE ENGINEER(VIP) - 515955
Taipei City, Taiwan
ACCOUNT SALES - 483043
Shanghai, China
APPLICATIONS ENGINEER, 3D-IC SOLUTIONS SALES - 519022
Seongnam, South KoreaYou’ll need a referral from an employee to apply for this job.
Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. Our solutions help companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation.
About the Role: As an Applications Engineer with Siemens EDA Technology Solutions Sales, you will support consultative sales efforts at the world's leading semiconductor and electronic equipment manufacturers.
Your primary responsibility is to secure technical design wins for Siemens EDA's product and service offerings. Specifically, you will drive technical wins for industry-leading Siemens 3D-IC solutions, including Innovator3D Integrator and Layout, alongside the Calibre family of 3DIC solutions (Calibre 3DSTACK, Calibre 3DThermal, Calibre 3DPERC, and Calibre 3DStress).
In this role, you will deliver technical presentations, conduct product demonstrations and benchmarks, and help develop solutions and account strategies to gain market share. Your territory coverage consists of Key Accounts located primarily (but not limited to) Korea. You will integrate with global peers and communicate status updates to various stakeholders and influential customers. International travel is required.
Qualifications
Required:
- Education & Experience: BSEE or MSEE with 4+ years of experience in the semiconductor field.
- Data Formats: Knowledge of IC and packaging data formats (e.g., Verilog, LEF/DEF, GDS, OASIS, ODB++).
- Industry Knowledge: Familiarity with 2.5D-IC and 3D-IC integration technology offerings (e.g., TSMC 3DFabric, Intel EMIB/Foveros).
- Technical Concepts: General understanding of Chiplet-based design challenges and methodologies.
- Scripting & OS: Solid scripting skills (Python, Tcl, Perl, or similar) and working knowledge of both Windows and Linux operating systems.
- Productivity Tools: Competency with Microsoft Word, Excel, and PowerPoint.
- Languages: professional working proficiency in English.
- Travel: General domestic and international travel.
Preferred
- Prior experience in a customer-facing role.
- Familiarity with 2.5D/3D-IC EDA cockpit solutions (e.g., Siemens Innovator3D IC Integrator, Cadence Integrity SystemPlanner, Synopsys 3DIC Compiler).
- Familiarity with IC package/interposer layout implementation methodologies and EDA tools (e.g., Cadence APD, Synopsys IC compiler, Cadence Innovus, etc ..).
- Direct experience with Siemens Calibre solutions (Calibre DRC/LVS and/or Calibre 3DSTACK).
The Ideal Candidate Will:
- Possess a passion to learn and perform at the cutting edge of technology.
- Have a desire to broaden exposure to the business aspects of the technical design world.
- Enjoy contributing to the success of a global team while being able to work independently with minimal supervision.
- Effectively influences stakeholders at any level.
- Build rapid rapport and credibility with customer organizations while maintaining a strong internal network of company contacts.
#LI-EDA
Korea Version JD
Main Duties
- Siemens EDA의 3D-IC 솔루션(Innovator3D IC Integrator/Layout, Calibre 3DSTACK/3DThermal/3DPERC/3DStress 등)에 대한 기술 영업 및 Design Win 확보
- Conducting technical presentations, demos, and benchmarks for customers
- Development of 3DIC design flow and automation script based on customer requirements
- Global Key Account technical support and collaboration with overseas teams
- Domestic and international business trips and customer technical support
Essential Competencies
- Bachelor's/Master's degree in Electronic Engineering and over 4 years of experience in semiconductor or package design
- Understanding IC data formats such as Verilog, LEF/DEF, GDS, OASIS, etc.
- 2.5D/3DIC, Chiplet, Advanced Packaging 기술 이해
- Innovator3D IC, Cadence APD, Synopsys 3DIC Compiler, Xpedition 등 관련 EDA 툴 경험 우대
- Calibre DRC/LVS/3DSTACK 경험 우대
- Scripting skills in Python, Tcl, Perl, etc .
- Experience using Windows/Linux
- English communication skills
Ideal candidate
- High interest in the latest semiconductor technologies and willingness to learn
- Building trust with customers and excellent communication skills
- Ability to work independently and collaborate globally
- An engineer who can understand technology and business together and support customer success




